Semiconductor

Photo

Clean / Etcher

Dicing

Bonding

Laser Saw

Handler

Probing

Image Inspection

Coater / Developer

F/C (Flip Chip) Bonder

Die / LED Bonder

01

Flat Panel Display

FPD Exposure

LCD Inspection

Mask Defect Repair

02

Industrial Robot

Wafer Transfer Robot

Pipe Vendor

03

Other Industries

ICT Device

Secondary Cell

Dispenser

Automatic Assembly Inspection

Cream Solder Printing

Active Alignment

Automatic Crimping Machine

04

• 01

  Semiconductor

• 02

  Flat Panel Display

• 03

  Industrial Robot

• 04

  Other Industries

Particularly, WMX is being widely used in the front-end and back-end processes for semiconductor, smartphone manufacturing devices.

Front-end process: making wafers and circuits on the wafers.

Back-end process: dicing circuits on the wafers, preparing wires for external connection, and assembly.

- Colored section is the processes where Movensys' solution is used.